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 HUFA75542P3, HUFA75542S3S
Data Sheet December 2001
75A, 80V, 0.014 Ohm, N-Channel, UltraFET(R) Power MOSFETs Packaging
JEDEC TO-220AB
SOURCE DRAIN GATE
JEDEC TO-263AB
Features
* Ultra Low On-Resistance - rDS(ON) = 0.014, VGS = 10V
GATE SOURCE DRAIN (FLANGE) HUFA75542P3 DRAIN (FLANGE) HUFA75542S3S
* Simulation Models - Temperature Compensated PSPICE(R) and SABERTM Electrical Models - Spice and SABER Thermal Impedance Models - www.fairchildsemi.com * Peak Current vs Pulse Width Curve * UIS Rating Curve
Symbol
D
Ordering Information
PART NUMBER HUFA75542P3 PACKAGE TO-220AB TO-263AB BRAND 75542P 75542S
G
HUFA75542S3S
S
NOTE: When ordering, use the entire part number. Add the suffix T to obtain the variant in tape and reel, e.g., HUFA75542S3ST.
Absolute Maximum Ratings
TC = 25oC, Unless Otherwise Specified HUFA75542P3, HUFA75542S3S UNITS V V V A A 80 80 20 75 58 Figure 4 Figures 6, 14, 15 230 1.54 -55 to 175 300 260 W W/oC
oC oC oC
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS Drain Current Continuous (TC = 25oC, VGS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Continuous (TC = 100oC, VGS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg NOTE: 1. TJ = 25oC to 150oC.
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/ Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html. All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
(c)2001 Fairchild Semiconductor Corporation HUFA75542P3, HUFA75542S3S Rev. B
HUFA75542P3, HUFA75542S3S
Electrical Specifications
PARAMETER OFF STATE SPECIFICATIONS Drain to Source Breakdown Voltage Zero Gate Voltage Drain Current BVDSS IDSS ID = 250A, VGS = 0V (Figure 11) VDS = 75V, VGS = 0V VDS = 70V, VGS = 0V, TC = 150oC Gate to Source Leakage Current ON STATE SPECIFICATIONS Gate to Source Threshold Voltage Drain to Source On Resistance THERMAL SPECIFICATIONS Thermal Resistance Junction to Case Thermal Resistance Junction to Ambient RJC RJA TO-220 and TO-263 0.65 62
oC/W oC/W
TC = 25oC, Unless Otherwise Specified SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
80 -
-
1 250 100
V A A nA
IGSS
VGS = 20V
VGS(TH) rDS(ON)
VGS = VDS, ID = 250A (Figure 10) ID = 75A, VGS = 10V (Figure 9)
2 -
0.012
4 0.014
V
SWITCHING SPECIFICATIONS (VGS = 10V) Turn-On Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-Off Time GATE CHARGE SPECIFICATIONS Total Gate Charge Gate Charge at 10V Threshold Gate Charge Gate to Source Gate Charge Gate to Drain "Miller" Charge CAPACITANCE SPECIFICATIONS Input Capacitance Output Capacitance Reverse Transfer Capacitance CISS COSS CRSS VDS = 25V, VGS = 0V, f = 1MHz (Figure 12) 2750 700 250 pF pF pF Qg(TOT) Qg(10) Qg(TH) Qgs Qgd VGS = 0V to 20V VGS = 0V to 10V VGS = 0V to 2V VDD = 40V, ID = 75A, Ig(REF) = 1.0mA (Figures 13, 16, 17) 150 80 5.7 15 33 180 96 7 nC nC nC nC nC tON td(ON) tr td(OFF) tf tOFF VDD = 40V, ID = 75A VGS = 10V, RGS = 3.9 (Figures 18, 19) 12.5 117 50 80 195 195 ns ns ns ns ns ns
Source to Drain Diode Specifications
PARAMETER Source to Drain Diode Voltage SYMBOL VSD ISD = 75A ISD = 37.5A Reverse Recovery Time Reverse Recovered Charge trr QRR ISD = 75A, dISD/dt = 100A/s ISD = 75A, dISD/dt = 100A/s TEST CONDITIONS MIN TYP MAX 1.25 1.00 102 255 UNITS V V ns nC
(c)2001 Fairchild Semiconductor Corporation
HUFA75542P3, HUFA75542S3S Rev. B
HUFA75542P3, HUFA75542S3S Typical Performance Curves
1.2 POWER DISSIPATION MULTIPLIER 1.0 0.8 0.6 0.4 0.2 0 0 25 50 75 100 125 150 175 TC , CASE TEMPERATURE (oC) 0 25 50 75 100 125 150 175 TC, CASE TEMPERATURE (oC) 80 VGS = 10V ID, DRAIN CURRENT (A) 2 1 THERMAL IMPEDANCE ZJC , NORMALIZED DUTY CYCLE - DESCENDING ORDER 0.5 0.2 0.1 0.05 0.02 0.01 0.1 PDM NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJC x RJC + TC 10-3 10-2 t, RECTANGULAR PULSE DURATION (s) 10-1 100 SINGLE PULSE 0.01 10-5 10-4 60
40
20
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs CASE TEMPERATURE
t1 t2 101
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
1000 TC = 25oC IDM , PEAK CURRENT (A) FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS: I = I25 175 - TC 150 VGS = 10V 100 TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION 50 10-5 10-4 10-3 10-2 t, PULSE WIDTH (s) 10-1 100 101
FIGURE 4. PEAK CURRENT CAPABILITY
(c)2001 Fairchild Semiconductor Corporation
HUFA75542P3, HUFA75542S3S Rev. B
HUFA75542P3, HUFA75542S3S Typical Performance Curves
500 IAS , AVALANCHE CURRENT (A) SINGLE PULSE TJ = MAX RATED TC = 25oC 100 100s
(Continued)
1000 If R = 0 tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD) If R 0 tAV = (L/R)ln[(IAS*R)/(1.3*RATED BV DSS - VDD) +1]
ID, DRAIN CURRENT (A)
100
STARTING TJ = 25oC STARTING TJ = 150oC
10
1ms 10ms
1 1
OPERATION IN THIS AREA MAY BE LIMITED BY rDS(ON) 10 VDS , DRAIN TO SOURCE VOLTAGE (V)
10 0.001 100 200
0.01
0.1
1
10
tAV, TIME IN AVALANCHE (ms)
NOTE: Refer to Fairchild Application Notes AN9321 and AN9322. FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA
150 PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VDD = 15V
150 VGS = 20V VGS = 10V VGS = 7V VGS = 6V
ID , DRAIN CURRENT (A)
90
ID , DRAIN CURRENT (A)
120
120
90 VGS = 5V 60
60 TJ = 175oC 30 TJ = 25oC
30
TJ = -55oC 0 4 5 6 0 1 2
PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX TC = 25oC 3 4
0 2 3 VGS , GATE TO SOURCE VOLTAGE (V)
VDS , DRAIN TO SOURCE VOLTAGE (V)
FIGURE 7. TRANSFER CHARACTERISTICS
FIGURE 8. SATURATION CHARACTERISTICS
2.5 NORMALIZED DRAIN TO SOURCE ON RESISTANCE PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX 2.0 NORMALIZED GATE THRESHOLD VOLTAGE
1.2 VGS = VDS, ID = 250A 1.0
1.5 VGS = 10V, ID = 75A 1.0
0.8
0.6
0.5 -80
-40
0
40
80
120
160
200
0.4 -80
-40
0
40
80
120
160
200
TJ, JUNCTION TEMPERATURE (oC)
TJ, JUNCTION TEMPERATURE (oC)
FIGURE 9. NORMALIZED DRAIN TO SOURCE ON RESISTANCE vs JUNCTION TEMPERATURE
FIGURE 10. NORMALIZED GATE THRESHOLD VOLTAGE vs JUNCTION TEMPERATURE
(c)2001 Fairchild Semiconductor Corporation
HUFA75542P3, HUFA75542S3S Rev. B
HUFA75542P3, HUFA75542S3S Typical Performance Curves
1.2 NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE ID = 250A C, CAPACITANCE (pF) 1.1
(Continued)
10000 VGS = 0V, f = 1MHz CISS = CGS + CGD
1.0
1000
COSS CDS + CGD
0.9
CRSS = CGD
0.8 -80
-40
0
40
80
120
160
200
100 0.1
1
10
80
TJ , JUNCTION TEMPERATURE (oC)
VDS , DRAIN TO SOURCE VOLTAGE (V)
FIGURE 11. NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE vs JUNCTION TEMPERATURE
FIGURE 12. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
10 VGS , GATE TO SOURCE VOLTAGE (V) VDD = 40V 8
6
4 WAVEFORMS IN DESCENDING ORDER: ID = 75A ID = 50A ID = 25A 0 20 40 60 80 100
2
0 Qg, GATE CHARGE (nC)
NOTE: Refer to Fairchild Application Notes AN7254 and AN7260. FIGURE 13. GATE CHARGE WAVEFORMS FOR CONSTANT GATE CURRENT
(c)2001 Fairchild Semiconductor Corporation
HUFA75542P3, HUFA75542S3S Rev. B
HUFA75542P3, HUFA75542S3S Test Circuits and Waveforms
VDS BVDSS L VARY tP TO OBTAIN REQUIRED PEAK IAS VGS DUT tP RG IAS VDD tP VDS VDD
+
-
0V
IAS 0.01
0 tAV
FIGURE 14. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 15. UNCLAMPED ENERGY WAVEFORMS
VDS RL VDD VDS VGS = 20V VGS
+
Qg(TOT)
Qg(10) VDD VGS VGS = 2V 0 Qg(TH) Qgs Ig(REF) 0 Qgd VGS = 10V
DUT Ig(REF)
FIGURE 16. GATE CHARGE TEST CIRCUIT
FIGURE 17. GATE CHARGE WAVEFORMS
VDS
tON td(ON) RL VDS
+
tOFF td(OFF) tr tf 90%
90%
VGS
DUT RGS
VDD 0
10% 90%
10%
VGS VGS 0 10%
50% PULSE WIDTH
50%
FIGURE 18. SWITCHING TIME TEST CIRCUIT
FIGURE 19. SWITCHING TIME WAVEFORM
(c)2001 Fairchild Semiconductor Corporation
HUFA75542P3, HUFA75542S3S Rev. B
HUFA75542P3, HUFA75542S3S PSPICE Electrical Model
.SUBCKT HUFA75542P3 2 1 3 ;
CA 12 8 4.4e-9 CB 15 14 4.2e-9 CIN 6 8 2.5e-9 DBODY 7 5 DBODYMOD DBREAK 5 11 DBREAKMOD DPLCAP 10 5 DPLCAPMOD
10
rev 15 Feb 2000
LDRAIN DPLCAP 5 RLDRAIN DBREAK 11 + EBREAK MWEAK MMED MSTRO CIN LSOURCE 8 RSOURCE RLSOURCE S1A 12 S1B CA 13 + EGS 6 8 EDS 13 8 S2A 14 13 S2B CB + 5 8 8 22 RVTHRES 14 IT VBAT + 15 17 RBREAK 18 RVTEMP 19 7 SOURCE 3 17 18 DBODY DRAIN 2 RSLC1 51 ESLC 50
RSLC2
5 51 ESG 6 8 + LGATE GATE 1 RLGATE EVTEMP RGATE + 18 22 9 20 EVTHRES + 19 8 6 -
IT 8 17 1 LDRAIN 2 5 1.0e-9 LGATE 1 9 2.6e-9 LSOURCE 3 7 1.1e-9 MMED 16 6 8 8 MMEDMOD MSTRO 16 6 8 8 MSTROMOD MWEAK 16 21 8 8 MWEAKMOD RBREAK 17 18 RBREAKMOD 1 RDRAIN 50 16 RDRAINMOD 5.5e-3 RGATE 9 20 1.0 RLDRAIN 2 5 10 RLGATE 1 9 26 RLSOURCE 3 7 11 RSLC1 5 51 RSLCMOD 1e-6 RSLC2 5 50 1e3 RSOURCE 8 7 RSOURCEMOD 3.3e-3 RVTHRES 22 8 RVTHRESMOD 1 RVTEMP 18 19 RVTEMPMOD 1 S1A S1B S2A S2B 6 12 13 8 S1AMOD 13 12 13 8 S1BMOD 6 15 14 13 S2AMOD 13 15 14 13 S2BMOD
VBAT 22 19 DC 1 ESLC 51 50 VALUE={(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*230),2.5))} .MODEL DBODYMOD D (IS = 2.5e-12 RS = 2.85e-3 XTI = 5.5 TRS1 = 2e-3 TRS2 = 1e-6 CJO = 3.2e-9 TT = 5.5e-8 M = 0.6) .MODEL DBREAKMOD D (RS = 2.9e- 1TRS1 = 1e- 3TRS2 = 1e-6) .MODEL DPLCAPMOD D (CJO = 3.4e- 9IS = 1e-3 0M = 0.8 N = 10) .MODEL MMEDMOD NMOS (VTO = 3.06 KP = 4.8 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 1) .MODEL MSTROMOD NMOS (VTO = 3.5 KP = 80 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u) .MODEL MWEAKMOD NMOS (VTO = 2.67 KP = 0.08 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 10) .MODEL RBREAKMOD RES (TC1 =1.3e- 3TC2 = -9e-7) .MODEL RDRAINMOD RES (TC1 = 1.1e-2 TC2 = 2.5e-5) .MODEL RSLCMOD RES (TC1 = 4.5e-3 TC2 = 1e-5) .MODEL RSOURCEMOD RES (TC1 = 0 TC2 = 0) .MODEL RVTHRESMOD RES (TC1 = -2.5e-3 TC2 = -1.1e-5) .MODEL RVTEMPMOD RES (TC1 = -2.75e- 3TC2 = 0) .MODEL S1AMOD VSWITCH (RON = 1e-5 .MODEL S1BMOD VSWITCH (RON = 1e-5 .MODEL S2AMOD VSWITCH (RON = 1e-5 .MODEL S2BMOD VSWITCH (RON = 1e-5 .ENDS ROFF = 0.1 ROFF = 0.1 ROFF = 0.1 ROFF = 0.1 VON = -6.0 VOFF= -4.5) VON = -4.5 VOFF= -6.0) VON = -0.5 VOFF= 0.5) VON = 0.5 VOFF= -0.5)
NOTE: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank Wheatley.
(c)2001 Fairchild Semiconductor Corporation
+
EBREAK 11 7 17 18 87.2 EDS 14 8 5 8 1 EGS 13 8 6 8 1 ESG 6 10 6 8 1 EVTHRES 6 21 19 8 1 EVTEMP 20 6 18 22 1
RDRAIN 21 16
HUFA75542P3, HUFA75542S3S Rev. B
HUFA75542P3, HUFA75542S3S SABER Electrical Model
REV 15 Feb 00 template HUFA75542P3 n2,n1,n3 electrical n2,n1,n3 { var i iscl dp..model dbodymod = (is = 2.5e-12, rs = 2.85e-3, xti = 5.5, trs1 = 2e-3, trs2 = 1e-6, cjo = 3.2e-9, tt = 5.5e-8, m = 0.6) dp..model dbreakmod = (rs = 2.9e-1, trs1 = 1e-3, trs2 = 1e-6) dp..model dplcapmod = (cjo = 3.4e-9, is = 1e-30, m = 0.8, nl = 10) m..model mmedmod = (type=_n, vto = 3.06, kp = 4.8, is = 1e-30, tox = 1) m..model mstrongmod = (type=_n, vto = 3.5, kp = 80, is = 1e-30, tox = 1) m..model mweakmod = (type=_n, vto = 2.67, kp = 0.08, is = 1e-30, tox = 1) sw_vcsp..model s1amod = (ron = 1e-5, roff = 0.1, von = -6.0, voff = -4.5) DPLCAP 5 sw_vcsp..model s1bmod = (ron =1e-5, roff = 0.1, von = -4.5, voff = -6.0) 10 sw_vcsp..model s2amod = (ron = 1e-5, roff = 0.1, von = -0.5, voff = 0.5) sw_vcsp..model s2bmod = (ron = 1e-5, roff = 0.1, von = 0.5, voff = -0.5) RSLC1 c.ca n12 n8 = 4.4e-9 c.cb n15 n14 = 4.2e-9 c.cin n6 n8 = 2.5e-9 dp.dbody n7 n5 = model=dbodymod dp.dbreak n5 n11 = model=dbreakmod dp.dplcap n10 n5 = model=dplcapmod i.it n8 n17 = 1 l.ldrain n2 n5 = 1e-9 l.lgate n1 n9 = 2.6e-9 l.lsource n3 n7 = 1.1e-9
LGATE GATE 1 RLGATE CIN 51 RSLC2 ISCL ESG + EVTEMP RGATE + 18 22 9 20 6 MSTRO 8 6 8 EVTHRES + 19 8 50 RDRAIN 21 16 MWEAK MMED EBREAK + 17 18 RSOURCE RLSOURCE S1A 12 13 8 S1B CA 13 + EGS 6 8 S2A 14 13 S2B CB + EDS 5 8 8 RVTHRES 14 IT VBAT + 22 15 17 RBREAK 18 RVTEMP 19 DBODY DBREAK 11
LDRAIN DRAIN 2 RLDRAIN
m.mmed n16 n6 n8 n8 = model=mmedmod, l=1u, w=1u m.mstrong n16 n6 n8 n8 = model=mstrongmod, l=1u, w=1u m.mweak n16 n21 n8 n8 = model=mweakmod, l=1u, w=1u res.rbreak n17 n18 = 1, tc1 = 1.3e-3, tc2 = -9e-7 res.rdrain n50 n16 = 5.5e-3, tc1 = 1.1e-2, tc2 = 2.5e-5 res.rgate n9 n20 = 1.0 res.rldrain n2 n5 = 10 res.rlgate n1 n9 = 26 res.rlsource n3 n7 = 11 res.rslc1 n5 n51 = 1e-6, tc1 = 4.5e-3, tc2 = 1e-5 res.rslc2 n5 n50 = 1e3 res.rsource n8 n7 = 3.3e-3, tc1 = 0, tc2 = 0 res.rvtemp n18 n19 = 1, tc1 = -2.75e-3, tc2 = 0 res.rvthres n22 n8 = 1, tc1 = -2.5e-3, tc2 = -1.1e-5 spe.ebreak n11 n7 n17 n18 = 87.2 spe.eds n14 n8 n5 n8 = 1 spe.egs n13 n8 n6 n8 = 1 spe.esg n6 n10 n6 n8 = 1 spe.evtemp n20 n6 n18 n22 = 1 spe.evthres n6 n21 n19 n8 = 1 sw_vcsp.s1a n6 n12 n13 n8 = model=s1amod sw_vcsp.s1b n13 n12 n13 n8 = model=s1bmod sw_vcsp.s2a n6 n15 n14 n13 = model=s2amod sw_vcsp.s2b n13 n15 n14 n13 = model=s2bmod v.vbat n22 n19 = dc=1 equations { i (n51->n50) +=iscl iscl: v(n51,n50) = ((v(n5,n51)/(1e-9+abs(v(n5,n51))))*((abs(v(n5,n51)*1e6/230))** 2.5)) } }
LSOURCE 7
SOURCE 3
(c)2001 Fairchild Semiconductor Corporation
HUFA75542P3, HUFA75542S3S Rev. B
HUFA75542P3, HUFA75542S3S SPICE Thermal Model
REV 15 Feb 00 T75542 CTHERM1 th 6 4.1e-3 CTHERM2 6 5 5.5e-3 CTHERM3 5 4 8.6e-3 CTHERM4 4 3 1.5e-2 CTHERM5 3 2 1.6e-2 CTHERM6 2 tl 6.5e-2 RTHERM1 th 6 2.0e-4 RTHERM2 6 5 3.5e-3 RTHERM3 5 4 2.5e-2 RTHERM4 4 3 9.0e-2 RTHERM5 3 2 1.6e-1 RTHERM6 2 tl 2.3e-1
RTHERM1 CTHERM1 th JUNCTION
6
RTHERM2
CTHERM2
5
RTHERM3
CTHERM3
SABER Thermal Model
SABER thermal model t75542 template thermal_model th tl thermal_c th, tl { ctherm.ctherm1 th 6 = 4.1e-3 ctherm.ctherm2 6 5 = 5.5e-3 ctherm.ctherm3 5 4 = 8.6e-3 ctherm.ctherm4 4 3 = 1.5e-2 ctherm.ctherm5 3 2 = 1.6e-2 ctherm.ctherm6 2 tl = 6.5e-2 rtherm.rtherm1 th 6 = 2.0e-4 rtherm.rtherm2 6 5 = 3.5e-3 rtherm.rtherm3 5 4 = 2.5e-2 rtherm.rtherm4 4 3 = 9.0e-2 rtherm.rtherm5 3 2 = 1.6e-1 rtherm.rtherm6 2 tl = 2.3e-1 }
4
RTHERM4
CTHERM4
3
RTHERM5
CTHERM5
2
RTHERM6
CTHERM6
tl
CASE
(c)2001 Fairchild Semiconductor Corporation
HUFA75542P3, HUFA75542S3S Rev. B
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DenseTrenchTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM
DISCLAIMER
FAST (R) FASTrTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM LittleFETTM MicroFETTM MicroPakTM MICROWIRETM
OPTOLOGICTM OPTOPLANARTM PACMANTM POPTM Power247TM PowerTrench (R) QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM SILENT SWITCHER (R)
SMART STARTTM STAR*POWERTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM TruTranslationTM UHCTM UltraFET (R)
VCXTM
STAR*POWER is used under license
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant into support device or system whose failure to perform can the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. H4


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